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TVS Diode Arrays (SPA ? Diodes)
Low Capacitance ESD Protection - SP3012 Series
Application Information
Signal Integrity of High-Speed Data Interfaces
Adding external ESD protection to a high-speed data port is
not trivial for a variety of reasons.
1. ESD protection devices will add parasitic capacitance
to each data line from line to GND and line to line causing
impedance mismatches between the differential pairs. This
ultimately affects the signal eye-diagram and whether or
not the transceiver can distinguish a “1” from a “0”.
2. ESD devices should be placed as close as possible
to the port being protected to maximize their effect (i.e.
clamping capability) and minimize the effect that PCB trace
inductance can have during an ESD transient. Depending
on the package size and pinout this could be challenging
and the bigger the package, the larger the land pattern
must be, which adds more parasitic capacitance.
3. Stub traces can add another element of discontinuity
adversely affecting signal integrity so ESD protection is
best employed when it’s “overlaid” on the data lines or
when the signals can simply pass underneath the device.
Taking all of this into account Littelfuse developed
the SP3012 Series which was designed specifically
for protection of high-speed data ports such as HDMI
1.3/1.4 and USB 3.0. They present less than 0.5pF from
line to GND and only 0.3pF from line to line minimizing
impedance mismatch between the differential pairs.
Figure 1: PCB Layout of the SP3012-06UTG for USB 3.0
J1
U1
Figure 2 shows the USB 3.0 eye diagram that resulted
from the PCB layout above with the SP3012-06UTG
soldered on the landing pattern.
500
0
Wfrms:500
Furthermore, the SP3012 is rated up to ±12kV (contact
-500
Base: 27.0000 ns
Scale:33.0 ps/div
discharge) which far exceeds the maximum requirement of
the IEC 61000-4-2 standard.
There are two options available (4 channel and 6 channel)
and both are housed in leadless μDFN packages so the
data lines can pass directly underneath the device to
reduce discontinuities and maintain signal integrity.
Figure 2: USB 3.0 Eye Diagram with the SP3012-06UTG
Using a similar layout as above, Figure 3 shows the eye
diagram that resulted using the SP3012-04UTG to protect
the Super-Speed data lines and the SP3003-02UTG to
protect the legacy data pair.
500
USB 3.0 Eye Diagram Data
Figure 1 shows the layout used for the SP3012-06UTG in a
USB 3.0 application. The traces routed toward the top are
the two legacy USB 2.0 lines (D+/D-) that run at the slower
speed of 480Mbps and therefore are not as critical as the
0
5Gbps Super-Speed traces.
Wfrms:850
-500
Base: 27.0000 ns
Scale:33.0 ps/div
Figure 3: USB 3.0 Eye Diagram with the SP3012-04UTG
SP3012 Series
4
?2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revision: 09 2, 13
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相关代理商/技术参数
SP3012-06UTG
功能描述:TVS二极管阵列 6 Ch 12KV 0.5pF
RoHS:否 制造商:Littelfuse 极性: 通道:4 Channels 击穿电压: 钳位电压:11.5 V 工作电压:2.5 V 峰值浪涌电流:20 A 安装风格:SMD/SMT 端接类型:SMD/SMT 系列: 最小工作温度:- 40 C 最大工作温度:+ 85 C
SP30150R
制造商:SECOS 制造商全称:SeCoS Halbleitertechnologie GmbH 功能描述:30.0AMP Schottky Barrier Rectifiers
SP301CS
制造商:SIPEX 制造商全称:Sipex Corporation 功能描述:RS-232/RS-422 Line Drivers/Receivers
SP301CT
制造商:SIPEX 制造商全称:Sipex Corporation 功能描述:RS-232/RS-422 Line Drivers/Receivers
SP301ES
制造商:SIPEX 制造商全称:Sipex Corporation 功能描述:RS-232/RS-422 Line Drivers/Receivers
SP301ET
制造商:SIPEX 制造商全称:Sipex Corporation 功能描述:RS-232/RS-422 Line Drivers/Receivers
SP-301P
功能描述:烙铁 SOLDERPOT W/PORCELAN 500W 120V
RoHS:否 制造商:Weller 产品:Soldering Stations 类型:Digital, Iron, Stand, Cleaner 瓦特:50 W 最大温度:+ 850 F 电缆类型:US Cord Included
SP-301-P
制造商:Techspray 功能描述:SOLDER POT; Approval Bodies:CE; External Height:1.5"; External Width:2.5"; Height:1.5"; Output Power:500W; Pot Temperature Range:500 to 1100 deg F; Power Rating:500W; Solder Capacity:2lb; Supply Voltage:120V; Width:2.5" ;RoHS Compliant: Yes